doc. no : qw0905-ly3330/t-pf rev. : a date : 05 - jun. - 2007 data sheet ly3330/t-pf low current round type led lamps lead-free parts pb ligitek electronics co.,ltd. property of ligitek only
25.0min 1.5max directivity radiation note : 1.all dimension are in millimeter tolerance is 2.specifications are subject to change without notice. 1.0min 2.54typ + 0.25mm unless otherwise noted. - 0.5 typ ly3330/t-pf package dimensions part no. 5.9 5.0 7.6 8.6 ligitek electronics co.,ltd. property of ligitek only page 1/5
absolute maximum ratings at ta=25 ! typical electrical & optical characteristics (ta=25 ! ) ma 80 i fp peak forward current duty 1/10@10khz max. forward voltage @ ma(v) color yellow diffused note : 1.the forward voltage data did not including " 0.1v testing tolerance. 2. the luminous intensity data did not including " 15% testing tolerance. emitted ly3330/t-pfgaasp/gapyellow material part no min. lens 585351.82.2 peak wave length # pnm spectral halfwidth $# nm 2 reverse current @5v power dissipation operating temperature storage temperature tstg t opr pd ir -40 ~ +85 -40 ~ +100 60 10 min. typ. 3.0 1.828 viewing angle 2 % 1/2 (deg) luminous intensity @2ma(mcd) ! ! mw & a ligitek electronics co.,ltd. property of ligitek only symbol forward current parameter i f y 20 ratings unit ma page2/5 part no. ly3330/t-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page 3/5 part no. ly3330/t-pf
2.wave soldering profile 5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 2 /sec max 25 0 0 50 preheat 120 150 time(sec) 100 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 c3sec max 260 temp( c) ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) page 4/5 part no. ly3330/t-pf
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. solder resistance test solderability test 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. low temperature storage test high temperature high humidity test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. high temperature storage test operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition test item description reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard page 5/5 part no. ly3330/t-pf
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